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Soldering processes and equipment / edited by Michael G. Pecht. [Books].
Material type:
TextPublication details: New York : Wiley, 1993. Description: xiv, 296 p. : ill. ; 25 cmISBN: 047159167XSubject(s): Electronic packaging -- Materials | Solder and soldering | Surface mount technologyOther classification: TK7870.15 SOL Online resources: Publisher description | Table of Contents
| Item type | Current library | Call number | Status | Notes | Date due | Barcode |
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General Collection
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Universiti Teknologi Brunei Library | TK7870.15 SOL c.1 (Browse shelf(Opens below)) | Available | Reg no. 26190_ITB | 809714 |
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| TK7870 WIL c.2 Elements of electronics book 2 : alternating current theory / | TK7870 WIL c.2 Elements of electronics book 3 : Semiconductor technology / | TK7870.15 ELE c.1 Electronic packaging and interconnection handbook / | TK7870.15 SOL c.1 Soldering processes and equipment / | TK7870.2 BOH Electronics servicing. Vol. 3, Core studies. | TK7870.2 BOH Electronics servicing. Vol. 3, Core studies. | TK7870.2 BOH Electronics servicing. Vol. 3, Core studies. |
"A Wiley-Interscience publication."
Includes bibliographical references and index.
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