Integrated modeling of chemical mechanical planarization for sub-micron IC fabrication : from particle scale to feature, die and wafer scales / [Book].
Jianfeng Luo, David Dornfeld.
- Berlin ; [London] : Springer, 2004.
- xxiv, 311 p. : ill. ; 24cm.
Includes bibliographical references and index.
9783540223696
2004109174
Integrated circuits--Design and construction--Simulation methods. Integrated circuits--Design and construction.