TY  - BOOK
AU  - Luo,Jianfeng
AU  - Dornfeld,D.A.
TI  - Integrated modeling of chemical mechanical planarization for sub-micron IC fabrication: from particle scale to feature, die and wafer scales 
SN  - 9783540223696
PY  - 2004///
CY  - Berlin ; , [London] : 
PB  - Springer, 
KW  - Integrated circuits
KW  - Design and construction
KW  - Simulation methods
N1  - Includes bibliographical references and index
UR  - http://www.loc.gov/catdir/enhancements/fy0813/2004109174-d.html
UR  - http://www.loc.gov/catdir/enhancements/fy0813/2004109174-t.html
ER  -