| 000 | 01048nam a22003017a 4500 | ||
|---|---|---|---|
| 001 | 191649 | ||
| 003 | MOEB | ||
| 005 | 20221223071800.0 | ||
| 008 | 930101s1993 nyua g 001 0 eng | ||
| 010 | _a92003770 | ||
| 020 | _a047159167X | ||
| 035 | _a92003770 | ||
| 035 | _a(SITECODE)OLD23459 | ||
| 040 | _aInstitut Teknologi Brunei | ||
| 084 | _aTK7870.15 SOL | ||
| 245 | 1 | 0 |
_aSoldering processes and equipment / _cedited by Michael G. Pecht. _h[Books]. |
| 260 |
_aNew York : _bWiley, _c1993. |
||
| 300 |
_axiv, 296 p. : _bill. ; _c25 cm. |
||
| 500 | _a"A Wiley-Interscience publication." | ||
| 504 | _aIncludes bibliographical references and index. | ||
| 650 | 0 |
_aElectronic packaging _xMaterials. |
|
| 650 | 0 | _aSolder and soldering. | |
| 650 | 0 | _aSurface mount technology. | |
| 700 | 1 | _aPecht, Michael. | |
| 856 | 4 | 2 |
_3Publisher description _uhttp://www.loc.gov/catdir/description/wiley032/92033770.html |
| 856 | 4 |
_3Table of Contents _uhttp://www.loc.gov/catdir/toc/onix02/92033770.html |
|
| 998 | _eBook | ||
| 999 |
_c10029 _d10029 |
||
| 911 |
_a1 _badmin admin |
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| 912 |
_a1 _badmin admin |
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