Integrated modeling of chemical mechanical planarization for sub-micron IC fabrication : from particle scale to feature, die and wafer scales /
Luo, Jianfeng.
Integrated modeling of chemical mechanical planarization for sub-micron IC fabrication : from particle scale to feature, die and wafer scales / [Book]. Jianfeng Luo, David Dornfeld. - Berlin ; [London] : Springer, 2004. - xxiv, 311 p. : ill. ; 24cm.
Includes bibliographical references and index.
9783540223696
2004109174
Integrated circuits--Design and construction--Simulation methods.
Integrated circuits--Design and construction.
Integrated modeling of chemical mechanical planarization for sub-micron IC fabrication : from particle scale to feature, die and wafer scales / [Book]. Jianfeng Luo, David Dornfeld. - Berlin ; [London] : Springer, 2004. - xxiv, 311 p. : ill. ; 24cm.
Includes bibliographical references and index.
9783540223696
2004109174
Integrated circuits--Design and construction--Simulation methods.
Integrated circuits--Design and construction.